TMS320DM814X datasheet(372/376 Pages) TI1

372 / 376 page

TMS320DM8148, TMS320DM8147

SPRS647E – MARCH 2011 – REVISED DECEMBER 2013

www.ti.com

10 Mechanical

The device package has been specially engineered with a new technology called Via Channel™. The Via

Channel technology allows larger than normal PCB via sizes and reduced PCB signal layers to be used in

a PCB design with this 0.8-mm pitch package, and will substantially reduce PCB costs. Via Channel also

allows PCB routing in only two signal layers (four layers total) due to the increased layer efficiency of the

Via Channel™ BGA technology.

10.1 Thermal Data for CYE-04 (Top Hat)

Table 10-1. Thermal Resistance Characteristics (PBGA Package) [CYE-04] (Thinner Top Hat)

NO.

°C/W(1)

AIR FLOW (m/s)(2)

ΘJC

Junction-to-case

0.39

N/A

ΘJB

Junction-to-board

3.87

N/A

ΘJA

Junction-to-free air

11.67

0.00

8.59

1.00

ΘJMA

Junction-to-moving air

7.80

2.00

7.33

3.00

0.19

0.00

0.20

1.00

PsiJT

Junction-to-package top

0.20

2.00

0.21

3.00

3.44

0.00

3.37

1.00

PsiJB

Junction-to-board

3.26

2.00

3.17

3.00

(1)

These measurements were conducted in a JEDEC defined 2S2P system (with the exception of the Theta JC [R

ΘJC] measurement,

which was conducted in a JEDEC defined 1S0P system) and will change based on environment as well as application. For more

information, see these EIA/JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Packages

Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.

(2)

m/s = meters per second

10.2 Packaging Information

The following packaging information and addendum reflect the most current data available for the

designated device(s). This data is subject to change without notice and without revision of this document.

372

Mechanical

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