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STM32L081CB Datasheet(PDF) 46 Page - STMicroelectronics |
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STM32L081CB Datasheet(HTML) 46 Page - STMicroelectronics |
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46 / 110 page ![]() Electrical characteristics STM32L081xx 46/110 DocID027513 Rev 4 6.3 Operating conditions 6.3.1 General operating conditions Table 20. General operating conditions Symbol Parameter Conditions Min Max Unit fHCLK Internal AHB clock frequency - 0 32 MHz fPCLK1 Internal APB1 clock frequency - 0 32 fPCLK2 Internal APB2 clock frequency - 0 32 VDD Standard operating voltage BOR detector disabled 1.65 3.6 V BOR detector enabled, at power on 1.8 3.6 BOR detector disabled, after power on 1.65 3.6 VDDA Analog operating voltage (all features) Must be the same voltage as VDD(1) 1.65 3.6 V VDDIO2 Standard operating voltage - 1.65 3.6 V VIN Input voltage on FT, FTf and RST pins(2) 2.0 V VDD 3.6 V -0.3 5.5 V 1.65 V VDD 2.0 V -0.3 5.2 Input voltage on BOOT0 pin - 0 5.5 Input voltage on TC pin - -0.3 VDD+0.3 PD Power dissipation at TA = 85 °C (range 6) or TA =105 °C (rage 7) (3) LQFP48 package - 370 mW UFQFPN32 package 556 LQFP32 package - 333 Power dissipation at TA = 125 °C (range 3) (3) LQFP48 package - 93 UFQFPN32 package 139 LQFP32 package - 83 TA Temperature range Maximum power dissipation (range 6) –40 85 °C Maximum power dissipation (range 7) –40 105 Maximum power dissipation (range 3) –40 125 TJ Junction temperature range (range 6) -40 °C TA 85 ° –40 105 Junction temperature range (range 7) -40 °C TA 105 °C –40 125 Junction temperature range (range 3) -40 °C TA 125 °C –40 130 1. It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV between VDD and VDDA can be tolerated during power-up and normal operation. 2. To sustain a voltage higher than VDD+0.3V, the internal pull-up/pull-down resistors must be disabled. 3. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJ max (see Table 19: Thermal characteristics on page 45). |
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