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STM8S903K3 Datasheet(PDF) 96 Page - STMicroelectronics |
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STM8S903K3 Datasheet(HTML) 96 Page - STMicroelectronics |
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96 / 121 page ![]() Package information STM8S903K3 STM8S903F3 96/121 DocID15590 Rev 10 Section 11.7: UFQFPN recommended footprint shows the recommended footprints for UFQFPN with and without on-board emulation. Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 52. UFQFPN20 marking example (package top view) 1. Parts marked as “ES”,”E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering samples to run qualification activity. L3 - 0.375 - - 0.0148 - L4 - 0.200 - - 0.0079 - L5 - 0.150 - - 0.0059 - b 0.180 0.250 0.300 0.0071 0.0098 0.0118 ddd - 0.050 - - 0.0020 - 1. Values in inches are converted from mm and rounded to 4 decimal digits Table 56. UFQFPN20 package mechanical data (continued) Dim. mm inches(1) Min Typ Max Min Typ Max |
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