ISL8270M

FN8635 Rev.4.00

Page 3 of 56

Aug 17, 2017

Firmware Revision History

Ordering Information

PART NUMBER

(Notes 2, 3, 4)

PART

MARKING

FIRMWARE

REVISION

(Note 5)

TEMP RANGE

(°C)

PACKAGE

(RoHS Compliant)

PKG.

DWG. #

ISL8270MAIRZ

ISL8270M

FC01

-40 to +85

40 Ld 17x19 HDA

Y40.17x19

ISL8270MBIRZ

ISL8270MB

FC02

-40 to +85

40 Ld 17x19 HDA

Y40.17x19

ISL8270MEVAL1Z

Evaluation Board

NOTES:

2. Add “-T” suffix for a 500 unit Tape and Reel option. Refer to TB347 for details on reel specifications.

3. These Intersil Pb-free plastic packaged products are RoHS compliant by EU exemption 7C-I and 7A. They employ special Pb-free material sets; molding

compounds/die attach materials and NiPdAu plate - e4 termination finish, which is compatible with both SnPb and Pb-free soldering operations. Intersil

Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

4. For Moisture Sensitivity Level (MSL), please see the product information page for ISL8270M. For more information on MSL, see TB363

5. See “Firmware Revision History”; only the latest firmware revision is recommended for new designs.

ISL

xxxxM

F

T

R

Z

S

INTERSIL DEVICE DESIGNATOR

BASE PART NUMBER

FIRMWARE REVISION

A: FC01

B: FC02

OPERATING TEMPERATURE

I: INDUSTRIAL (- 40°C TO +85°C)

SHIPPING OPTION

BLANK: BULK

T: TAPE AND REEL

ROHS

Z: ROHS COMPLIANT

PACKAGE DESIGNATOR

R: HIGH DENSITY ARRAY (HDA)

TABLE 1. ISL8270M NOMENCLATURE GUIDE

FIRMWARE REVISION CODE

CHANGE DESCRIPTION

NOTE

ISL8270-000-FC01

Initial Release

Not recommended for new designs

ISL8270-000-FC02

1. Fixed bug: PMBus address read issue at low temperature

2. Fixed bug: PMBus locks up when noise is present

3. Corrected snapshot functionality behavior

4. Changed VIN_OV_WARN_LIMIT to 13.2V

5. Changed VIN_OV_FAULT_LIMIT to 14.5V

Recommended for new designs