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ZXLD1370EST16TC Datasheet(PDF) 4 Page - Diodes Incorporated

Part # ZXLD1370EST16TC
Description  60V HIGH ACCURACY BUCK/BOOST/BUCK-BOOST
PDF  40 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

ZXLD1370EST16TC Datasheet(HTML) 4 Page - Diodes Incorporated

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ZXLD1370
Document number: DS32165 Rev. 6 - 2
4 of 40
www.diodes.com
December 2016
© Diodes Incorporated
ZXLD1370
Absolute Maximum Ratings (Note 5) (Voltages to GND, unless otherwise specified.)
Symbol
Parameter
Rating
Unit
VIN
Input Supply Voltage Relative to GND
-0.3 to +65
V
VAUX
Auxiliary Supply Voltage Relative to GND
-0.3 to +65
V
VISM
Current Monitor Input Relative to GND
-0.3 to +65
V
VSENSE
Current Monitor Sense Voltage (VIN-VISM)
-0.3 to +5
V
VGATE
Gate Driver Output Voltage
-0.3 to +20
V
IGATE
Gate Driver Continuous Output Current
18
mA
VFLAG
Flag Output Voltage
-0.3 to 40
V
VPWM, VADJ,
VTADJ, VGI
Other Input Pins
-0.3 to +5.5
V
TJ
Maximum Junction Temperature
150
°C
TST
Storage Temperature
-55 to +150
°C
Caution:
Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and
transporting these devices.
Package Thermal Data
Thermal Resistance
Package
Typical
Unit
Junction-to-
Ambient, θJA (Note 6)
TSSOP-16EP
50
°C/W
Junction-to-
Case, θJC
TSSOP-16EP
23
°C/W
Notes:
5. For correct operation SGND and PGND should always be connected together.
6. Measured on High Effective Thermal Conductivity Test Board" according JESD51.



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