ZXLD1370EST16TC datasheet(33/40 Pages) DIODES

33 / 40 page

ZXLD1370

Document number: DS32165 Rev. 6 - 2

33 of 40

www.diodes.com

December 2016

ZXLD1370

Application Information (Cont.)

PCB Layout Considerations

PCB layout is a fundamental activity to get the most of the device in all configurations. In the following section it is possible to find some

important insight to design with the ZXLD1370 both in Buck and Buck-Boost configurations.

Figure 39 Circuit Layout

Here are some considerations useful for the PCB layout:



In order to avoid ringing due to stray inductances, the inductor L1, the anode of D1 and the drain of Q1 should be placed as close

together as possible.



The shaping capacitor C1 is fundamental for the stability of the control loop. To this end, it should be placed no more than 5mm from

the SHP pin.



Input voltage pins, VIN and VAUX, need to be decoupled. It is recommended to use two ceramic capacitors of 2.2uF, X7R, 100V (C3

and C4). In addition to these capacitors, it is suggested to add two ceramic capacitors of 1uF, X7R, 100V each (C2, C8), as well as a

further decoupling capacitor of 100nF close to the VIN/VAUX pins (C9). VIN and VAUX pins can be short-circuited when the device is

used in buck mode, or can be driven from a separate supply.

SHP Pin

VIN / VAUX

Decoupling

Inductor, Switch and

Freewheeling Diode

ZXLD1370EST16TC Datasheet(PDF) 33 Page - Diodes Incorporated