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STM32H723VG Datasheet(PDF) 91 Page - STMicroelectronics

Part # STM32H723VG
Description  32-bit Arm® Cortex®-M7 550 MHz MCU, up to 1 MB Flash memory, 564 KB RAM, 35 comms peripherals and analog interfaces
PDF  227 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32H723VG Datasheet(HTML) 91 Page - STMicroelectronics

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DS13313 Rev 2
91/227
STM32H723xE/G
Electrical characteristics
208
fCPU
Arm® Cortex®-M7 clock frequency
VOS3
-
-
170
MHz
VOS2
-
-
300
VOS1
-
-
400
VOS0
-
-
520
VOS0 and
CPU_FREQ_BOOST
--
550
fACLK
AXI clock frequency
VOS3
-
-
85
VOS2
-
-
150
VOS1
-
-
200
VOS0
-
-
275
fHCLK
AHB clock frequency
VOS3
-
-
85
VOS2
-
-
150
VOS1
-
-
200
VOS0
-
-
275
fPCLK
APB clock frequency
VOS3
-
-
42.5(4)
VOS2
-
-
75
VOS1
-
-
100
VOS0
-
-
137.5
TA(5)
Ambient temperature for
temperature range 3
Maximum power
dissipation
−40
125
°C
Ambient temperature for
temperature range 6
Maximum power
dissipation
−40
85
Low-power
dissipation(6)
−40
105
1. When RESET is released, the functionality is guaranteed down to VPDRmax or down to the specified VDDmin when the PDR
is OFF. The PDR can only be switched OFF though the PDR_ON pin that not available in all packages.
2. This formula has to be applied on power supplies related to the I/O structure described by the pin definition table.
3. At startup, the external VCORE voltage must remain higher or equal to 1.10 V before disabling the internal regulator (LDO).
4. This value corresponds to the maximum APB clock frequency when at least one peripheral is enabled.
5. The device junction temperature must be kept below maximum TJ indicated in Table 13: Supply voltage and maximum
temperature configuration and the maximum temperature.
6. In low-power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see Section 7.5:
Thermal characteristics).
Table 12. General operating conditions (continued)
Symbol
Parameter
Operating
conditions
Min
Typ
Max
Unit



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