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STM32H723VG Datasheet(PDF) 220 Page - STMicroelectronics |
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STM32H723VG Datasheet(HTML) 220 Page - STMicroelectronics |
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220 / 227 page ![]() Package information STM32H723xE/G 220/227 DS13313 Rev 2 7.4 UFBGA144 package information UFBGA144 is a 144-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package. Figure 74. UFBGA144 package outline 1. Drawing is not to scale. Table 124. UFBGA144 package mechanical data Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A 0.460 0.530 0.600 0.0181 0.0209 0.0236 A1 0.050 0.080 0.110 0.0020 0.0031 0.0043 A2 0.400 0.450 0.500 0.0157 0.0177 0.0197 A3 - 0.130 - - 0.0051 - A4 0.270 0.320 0.370 0.0106 0.0126 0.0146 b 0.230 0.280 0.320 0.0091 0.0110 0.0126 D 6.950 7.000 7.050 0.2736 0.2756 0.2776 D1 5.450 5.500 5.550 0.2146 0.2165 0.2185 E 6.950 7.000 7.050 0.2736 0.2756 0.2776 E1 5.450 5.500 5.550 0.2146 0.2165 0.2185 e - 0.500 - - 0.0197 - F 0.700 0.750 0.800 0.0276 0.0295 0.0315 A0AS_ME_V2 Seating plane A1 e F F D M Øb (144 balls) A E TOP VIEW BOTTOM VIEW 1 12 e A A2 Y X Z ddd Z D1 E1 eee Z Y X fff Ø Ø M M Z A3 A4 A1 ball identifier A1 ball index area |
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