MPC5675KFF0VMS2R datasheet(72/147 Pages) NXP

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MPC5675K Microcontroller Data Sheet, Rev. 9

Electrical characteristics

NXP Semiconductors

3.4

Thermal characteristics

3.4.1

General notes for specifications at maximum junction temperature

An estimation of the chip junction temperature, TJ, can be obtained from Equation 1:

TJ =TA +(RθJA ×PD)

Eqn. 1

where:

= ambient temperature for the package (oC)

RθJA

= junction to ambient thermal resistance (oC/W)

= power dissipation in the package (W)

The junction to ambient thermal resistance is an industry standard value that provides a quick and easy estimation of thermal

performance. Unfortunately, there are two values in common usage: the value determined on a single layer board and the value

obtained on a board with two planes. For packages such as the PBGA, these values can be different by a factor of two. Which

value is closer to the application depends on the power dissipated by other components on the board. The value obtained on a

single layer board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the internal

planes is usually appropriate if the board has low power dissipation and the components are well separated.

When a heat sink is used, the thermal resistance is expressed in Equation 2 as the sum of a junction to case thermal resistance

and a case to ambient thermal resistance:

Table 13. Thermal characteristics for package options

No.

Symbol

Parameter

Conditions

Value

Unit

BGA

257

BGA

473

1RθJA

CC Thermal resistance junction-to-ambient

natural convection1

1 Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board

meets JEDEC specification for this package.

Single layer board – 1s

≤ 40

≤ 34 °C/W

2RθJA

CC Thermal resistance junction-to-ambient

natural convection1

Four layer board – 2s2p

≤ 22

≤ 20 °C/W

3RθJMA CC Thermal resistance

junction-to-moving-air ambient1

@ 200 ft./min.,

single layer board – 1s

≤ 32

≤ 26 °C/W

4RθJMA CC Thermal resistance

junction-to-moving-air ambient1

@ 200 ft./min.,

four layer board – 2s2p

≤ 18

≤ 17 °C/W

5RθJB

CC Thermal resistance junction-to-board2

2 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC

specification for the specified package.

—

≤ 10

≤ 10 °C/W

6RθJC

CC Thermal resistance junction-to-case3

3 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate

temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.

—

≤ 6

°C/W

ΨJT

CC Junction-to-package-top natural

convection4

4 Thermal characterization parameter indicating the temperature difference between the package top and the

junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization

parameter is written as Psi-JT.

—

≤ 2

≤ 2°C/W

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