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HC05RC17GRS/D Datasheet(PDF) 126 Page - NXP Semiconductors

Part # HC05RC17GRS/D
Description  General Release Specification
PDF  128 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

HC05RC17GRS/D Datasheet(HTML) 126 Page - NXP Semiconductors

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Ordering Information
General Release Specification
MC68HC05RC17 — Rev. 2.0
Ordering Information
14.6 ROM Verification Units (RVUs)
After receiving the signed listing verify form, Freescale manufactures a
custom photographic mask. The mask contains the customer’s
application program and is used to process silicon wafers. The
application program cannot be changed after the manufacture of the
mask begins. Freescale then produces 10 MCUs, called RVUs, and
sends the RVUs to the customer. RVUs are usually packaged in
unmarked ceramic and tested to 5 Vdc at room temperature. RVUs are
not tested to environmental extremes because their sole purpose is to
demonstrate that the customer’s user ROM pattern was properly
implemented. The 10 RVUs are free of charge with the minimum order
quantity. These units are not to be used for qualification or production.
RVUs are not guaranteed by Freescale Quality Assurance.
14.7 MC Order Numbers
Table 14-1
shows the MC order numbers for the available package
types.
Table 14-1. MC Order Numbers
Package Type
Operating
Temperature
Range
MC Order Number
28-Pin Plastic Dual In-Line
Package (DIP)
0 °C to 70 °C
MC68HC05RC17P
28-Pin Small Outline Integrated
Circuit Package (SOIC)
0 °C to 70 °C
MC68HC05RC17DW
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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