603 Hardware Specifications

29

Appendix A

General Handling Recommendations for the

C4-CQFP Package

The following list provides a few guidelines for package handling:

•

Handle the electrostatic discharge sensitive (ESD) package with care before, during, and after

processing.

•

Do not apply any load to exceed 3 Kg after assembly.

•

Components should not be hot-dip tinned.

•

The package encapsulation is an acrylated urethane. Use adequate ventilation (local exhaust) for all

elevated temperature processes.

The package parameters are as follows:

Heat sink adhesive

AIEG-7655

IBM reference drawing

99F4869

Test socket

Yamaichi QFP-PO 0.5-240P

Signal

165

Power/ground

75

Total

240

A.1 Package Environmental, Operation, Shipment,

and Storage Requirements

The environmental, operation, shipment, and storage requirements are as follows:

•

Make sure that the package is suitable for continuous operation under business office environments.

— Operating environment: 10

°C to 40 °C, 8% to 80% relative humidity

— Storage environment: 1

°C to 60 °C, up to 80% relative humidity

— Shipping environment: 40

°C to 60 °C, 5% to 100% relative humidity

•

This component is qualified to meet JEDEC moisture Class 2.

After expiration of shelf life, packages may be baked at 120

°C (+10/–5 °C) for 4 hours minimum

and then be used or repackaged. Shelf life is as specified by JEDEC for moisture Class 2

components.

A.2 Card Assembly Recommendations

This section provides recommendations for card assembly process. Follow these guidelines for card

assembly.

•

This component is supported for aqueous, IR, convection reflow, and vapor phase card assembly

processes.

•

The temperature of packages should not exceed 220

°C for longer than 5 minutes.

•

The package entering a cleaning cycle must not be exposed to temperature greater than that

occurring during solder reflow or hot air exposure.

•

It is not recommended to re-attach a package that is removed after card assembly.

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