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603 Hardware Specifications

During the card assembly process, no solvent can be used with the C4FP, and no more than 3 Kg of force

must be applied normal to the top of the package prior to, during, or after card assembly. Other details of

the card assembly process follow:

Solder paste

Either water soluble (for example, Alpha 1208) or no clean

Solder stencil thickness

0.152 mm

Solder stencil aperature

Width reduced to 0.03 mm from the board pad width

Placement tool

Panasonic MPA3 or equivalent

Solder reflow

Infrared, convection, or vapor phase

Solder reflow profile

Infrared and/or convection

• Average ramp-up—0.48 to 1.8

°C/second

• Time above 183

°C—45 to 145 seconds

• Minimum lead temperature—200

°C

• Maximum lead temperature—240

°C

• Maximum C4FP temperature—245

°C

Vapor phase

• Preheat (board)—60

°C to 150 °C

• Time above 183

°C—60 to 145 seconds

• Minimum lead temperature—200

°C

• Maximum C4FP temperature—220

°C

• Egress temperature—below 150

°C

Clean after reflow

De-ionized (D.I.) water if water-soluble paste is used

• Cleaner requirements—conveyorized, in-line

• Minimum of four washing chambers

— Pre-clean chamber: top and bottom sprays, minimum top-side

pressure of 25 psig, water temperature of 70

°C minimum, dwell

time of 24 seconds minimum, water is not re-used, water flow rate

of 30 liters/minute.

— Wash chamber #1: top and bottom sprays, minimum top-side

pressure of 48 psig, minimum bottom-side pressure of 44 psig,

water temperature of 62.5

°C (±2.5 °C), dwell time of 48 seconds

minimum, water flow rate of 350 liters/minute.

— Wash chamber #2: top and bottom sprays, minimum top-side

pressure of 32 psig, minimum bottom-side pressure of 28 psig,

water temperature of 72.5

°C (±2.5 °C), dwell time of 48 seconds

minimum, water flow rate of 325 liters/minute.

— Final rinse chamber: top and bottom sprays, minimum top-side

pressure of 25 psig, water temperature of 72.5

°C minimum, dwell

time of 24 seconds minimum, water flow rate of 30 liters/minute.

• No cleaning required if “no clean solder paste” is used

Touch-up and repair

Water soluble (for example, Kester 450) or No Clean Flux

C4FP removal

Hot air rework

C4FP replace

Hand solder

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