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SST39VF6401B Datasheet(PDF) 34 Page - Microchip Technology |
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SST39VF6401B Datasheet(HTML) 34 Page - Microchip Technology |
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34 / 38 page ![]() ©2015-2018 DS20005008C 34 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B Not Recommended for New Designs Packaging Diagrams Figure 25:48-lead Thin Small Outline Package (TSOP) 12mm x 20mm Package Code: EK 1.05 0.95 0.70 0.50 18.50 18.30 20.20 19.80 0.70 0.50 12.20 11.80 0.27 0.17 0.15 0.05 48-tsop-EK-8 Note: 1. Complies with JEDEC publication 95 MO-142 DD dimensions, although some dimensions may be more stringent. 2. All linear dimensions are in millimeters (max/min). 3. Coplanarity: 0.1 mm 4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads. 1.20 max. 1mm 0˚- 5˚ DETAIL Pin # 1 Identifier 0.50 BSC |
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