SL3S1005FUD2SLASHHAP datasheet(7/33 Pages) NXP

Part #	SL3S1005FUD2/HAP

Description	The UCODE 9xm is the latest NXP product of the UCODE family supporting user memory.

PDF	33 Pages

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Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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NXP Semiconductors

SL3S1005

UCODE 9xm

7 Wafer layout

aaa-038696

not to scale!

(1)

(10)

(2)

(12)

(4)

(3)

TP2

TP1

RF2

RF1

(6)

(7)

(8)

(9)

(5)

(13)

(11)

1. Die to die distance (metal sealring - metal sealring) 16.6 µm, (X-scribe line width: 8.6 µm)

2. Die to die distance (metal sealring - metal sealring) 16.6 µm, (Y-scribe line width: 8.6 µm)

3. Chip step, Y-length: 533.6 µm

4. Chip step, X-length: 518.6 µm

5. Bump to bump distance X (RF1 - RF2): 115 µm

6. Distance bump to metal sealring Y: 17.5 µm

7. Bump size (TP1, TP2) Y: 70.5 µm

8. Bump to bump distance Y (RF1 - TP2, RF2 - TP1): 50 µm

9. Bump size (RF1, RF2) Y: 361.5 µm

10. Distance bump to metal sealring X: 17.5 µm

11. Bump size (TP1, TP2) X: 160.1 µm

12. Bump size (RF1, RF2) X: 176 µm

13. Distance bump to metal sealring Y: 484.5µm

Figure 3. UCODE 9xm plasma diced, 12" wafer layout

SL3S1005

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Product data sheet

Rev. 3.1 — 12 February 2025

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