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TXS0206AYFPR Datasheet(PDF) 22 Page - Texas Instruments

Part # TXS0206AYFPR
Description  TXS0206A SD Card Voltage-Translation Transceiver
PDF  31 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TXS0206AYFPR Datasheet(HTML) 22 Page - Texas Instruments

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E4
A4
B4
D4
DAT1B
DAT2B
DAT3B
CMDB
CMDB
CLKB
DAT0B
VCCA
DAT0A
DAT1A
DAT2A
DAT3A
CMDA
CLKA
CLK-f
GND
GND
VCCB
DAT0B
DAT1B
DAT2B
DAT3B
CMDB
CLKB
VDDA
DAT0
DAT1
DAT2
DAT3
CMD
CLK
CLKin
GND
CD
VSS
A2
D1
E1
A1
B1
C1
D2
E2
C2
C3
VCCA
VCCB
Memory Stick
Controller
™
TXS0206
C3
0.1 µF
C4
0.1 µF
C1
0.1 µF
VCCB
U1A
U2
B3
C4
D3
Memory Stick™
Connector
CD
CD
B2
VCC
SCLK
DATA3 (see Note)
INS
DATA2 (see Note)
DATA0/SDIO (see Note)
DATA1 (see Note)
BS
VSS
1
DAT1B
2
DAT0B
3
DAT2B
4
CD
5
DAT3B
6
CLKB
7
8
9
10
22
TXS0206A
SCES833B – NOVEMBER 2011 – REVISED APRIL 2016
www.ti.com
Product Folder Links: TXS0206A
Submit Documentation Feedback
Copyright © 2011–2016, Texas Instruments Incorporated
System Examples (continued)
Figure 9. Interfacing With Memory Stick™ Card
10 Power Supply Recommendations
The TXS0206A does not require power sequencing between VCCA and VCCB during power-up so the power-
supply rails can be ramped in any order.
The EN pin is referenced to VCCA and when configured to low, will place all outputs into a high-impedance state.
To ensure the high-impedance state of the outputs during power up or power down, the EN pin must be tied to
GND through a pulldown resistor and must not be enabled until VCCA and VCCB are fully ramped and stable. The
minimum value of the pulldown resistor to ground is determined by the current-sourcing capability of the driver
controlling the EN pin.
Finally, the EN pin may be shorted to VCCA if the application does not require use of the high-impedance state at
any time.
11 Layout
11.1 Layout Guidelines
To ensure reliability of the device, TI recommends following common printed-circuit board layout guidelines.
•
Bypass capacitors should be used on power supplies.
•
Short trace lengths should be used to avoid excessive loading
•
PCB signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than
the one shot duration, approximately 30 ns, ensuring that any reflection encounters low impedance at the
source driver
•
With very heavy capacitive loads, the one-shot can time-out before the signal is driven fully to the positive rail,
so it is recommended that this lumped-load capacitance be considered and kept below 50 pF to avoid O.S.
retriggering, bus contention, output signal oscillations, or other adverse system-level affects.



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