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TXS0206A

SCES833B – NOVEMBER 2011 – REVISED APRIL 2016

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Copyright © 2011–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCCA

Supply voltage, A-Port

–0.5

4.6

V

VCCB

Supply voltage, B-Port

–0.5

4.6

V

VI

Input voltage

I/O ports (A port)

–0.5

4.6

V

I/O ports (B port)

–0.5

4.6

Control inputs

–0.5

4.6

VO

Voltage range applied to any output in the high-impedance or power-off

state

A port

–0.5

4.6

V

B port

–0.5

4.6

VO

Voltage range applied to any output in the high or low state

A port

–0.5

4.6

V

B port

–0.5

4.6

IIK

Input clamp current

VI < 0

–50

mA

IOK

Output clamp current

VO < 0

–50

mA

IO

Continuous output current

±50

mA

Continuous current through VCCA or GND

±100

mA

Tstg

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2500

V

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±1500

Machine model (MM)

±250