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LMZ22010TZE/NOPB Datasheet(PDF) 18 Page - Texas Instruments |
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LMZ22010TZE/NOPB Datasheet(HTML) 18 Page - Texas Instruments |
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18 / 37 page ![]() CIN1 RFBT CSS RFBB VOUT Share Clk LMZ22010 LOAD VIN CIN6 (OPT) CO3,4 CIN5 (OPT) + CIN2,3,4 CO1 (OPT) CO2 (OPT) CO5 (OPT) RSYNC RENB RENT D1 5.1V (OPT) LMZ22010 SNVS687H – MARCH 2011 – REVISED AUGUST 2015 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The LMZ22010 is a step-down DC-to-DC power module. It is typically used to convert a higher DC voltage to a lower DC voltage with a maximum output current of 10 A. The following design procedure can be used to select components for the LMZ22010. Alternately, the WEBENCH software may be used to generate complete designs. When generating a design, the WEBENCH software uses iterative design procedure and accesses comprehensive databases of components. Please go to www.ti.com for more details. 8.2 Typical Application Figure 50. Typical Application Schematic Diagram 8.2.1 Design Requirements For this example the following application parameters exist. • VIN Range = Up to 20 V • VOUT = 0.8 V to 6 V • IOUT = 10 A 8.2.2 Detailed Design Procedure 8.2.2.1 Design Steps The LMZ22010 is fully supported by WEBENCH which offers: component selection, electrical and thermal simulations. Additionally, there are both evaluation and demonstration boards that may be used as a starting point for design. The following list of steps can be used to manually design the LMZ22010 application. All references to values refer to the typical applications schematic Figure 50. 1. Select minimum operating VIN with enable divider resistors 2. Program VOUT with FB resistor divider selection 3. Select COUT 4. Select CIN 5. Determine module power dissipation 6. Layout PCB for required thermal performance 18 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMZ22010 |
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