20

40

60

80

100

120

0

2

4

6

8

10

12

TEMPERATURE (C)

JA = 9.9 °C/W

JA = 6.8 °C/W

JA = 5.2 °C/W

0

2

4

6

8

10

12

3

6

9

12

15

18

21

24

27

30

COPPER AREA (in

2

)

2 Layer 0 LFPM

2 Layer 225 LFPM

4 Layer 0 LFPM

4 Layer 225 LFPM

LMZ22010

www.ti.com

SNVS687H – MARCH 2011 – REVISED AUGUST 2015

Typical Characteristics (continued)

Unless otherwise specified, the following conditions apply: VIN = 12 V; CIN = three × 10 μF + 47-nF X7R Ceramic; COUT = two

× 330-

μF Specialty Polymer + 47-µF Ceramic + 47-nF Ceramic; CFF = 4.7 nF; TA = 25° C for waveforms. All indicated

temperatures are ambient.

VIN = 12 V, VOUT = 3.3 V

Figure 31. Thermal Derating

Figure 32.

θJA vs Copper Heat Sinking Area

12 VIN, 5 VOUT at Full Load, BW = 20 MHz

12 VIN, 5 VOUT at Full Load, BW = 250 MHz

Figure 33. Output Ripple

Figure 34. Output Ripple

12 VIN, 3.3 VOUT at Full Load, BW = 250 MHz

12 VIN, 3.3 VOUT at Full Load, BW = 20 MHz

Figure 36. Output Ripple

Figure 35. Output Ripple

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