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L99LDLH32 Datasheet(PDF) 133 Page - STMicroelectronics |
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L99LDLH32 Datasheet(HTML) 133 Page - STMicroelectronics |
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133 / 142 page ![]() DS12879 Rev 6 133/142 L99LDLH32 Package and PCB thermal data 141 9 Package and PCB thermal data 9.1 QFN-48L 7x7 thermal data Figure 87. QFN-48L 7x7 on four-layer PCB Table 83. PCB properties Dimension Value Board finish thickness 1.6 mm +/- 10% Board dimension 129 mm x 60 mm Board Material FR4 Copper thickness (outer layers) 0.070 mm Copper thickness (inner layers) 0.035 mm Thermal vias separation 1.2 mm Thermal via diameter 0.3 mm +/- 0.08 mm Copper thickness on vias 0.025 mm Cu on top layer: 90% Cu on bottom layer: 90% Cu on mid1 layer: full coverage Cu on mid2 layer: full coverage |
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