L99DZ80EP datasheet(59/68 Pages) STMICROELECTRONICS

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L99DZ80EP

Package and packing information

6.1

ECOPACK® package

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

6.2

TQFP-64 mechanical data

Table 45. TQFP-64 mechanical data

Symbol

Millimeters

Min.

Typ.

Max.

1,20

0,05

0,15

0,95

1,00

1,05

0,17

0,22

0,27

c0,09

0,20

11,80

12,00

12,20

9,80

10,00

10,20

D2(1)

The size of exposed pads is variable depending on lead frame design and pad size end user should verify

"D2" and "E2" dimensions for each device application

5,85

6,00

6,15

7,50

11,80

12,00

12,20

9,80

10,00

10,20

E2(1)

5,85

6,00

6,15

7,50

0,50

0,45

0,60

0,75

1,00

0°

3,50°

7°

ccc

0,08

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