POWER DISSIPATION

DFN(

PL)2527-10

Ver. A

i

The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.

The following measurement conditions are based on JEDEC STD. 51-7.

Measurement Conditions

Item

Measurement Conditions

Environment

Mounting on Board (Wind Velocity = 0 m/s)

Board Material

Glass Cloth Epoxy Plastic (Four-Layer Board)

Board Dimensions

76.2 mm × 114.3 mm × 0.8 mm

Copper Ratio

Outer Layer (First Layer): Less than 95% of 50 mm Square

Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square

Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square

Through-holes

 0.3 mm × 30 pcs

Measurement Result

(Ta = 25°C, Tjmax = 125°C)

Item

Measurement Result

Power Dissipation

2500 mW

Thermal Resistance (

ja)

ja = 39°C/W

Thermal Characterization Parameter (ψjt)

ψjt = 11°C/W

ja: Junction-to-Ambient Thermal Resistance

ψjt: Junction-to-Top Thermal Characterization Parameter

Power Dissipation vs. Ambient Temperature

Measurement Board Pattern

0

500

1000

1500

2000

2500

3000

0

25

50

75

100

125

Ambient Temperature (

°C)

85

2500