STA323W datasheet(74/77 Pages) STMICROELECTRONICS

74 / 77 page

Package information

STA323W

74/77

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 74.

PowerSO-36 slug down dimensions

Symbol

inch

Min

Typ

Max

Min

Typ

Max

--3.60

--0.142

0.10

0.30

.004

.012

--3.30

--0.130

0.10

.004

0.22

0.38

0.009

0.015

0.23

0.32

0.009

0.013

15.80

16.00

0.622

0.630

9.40

9.80

0.370

0.386

13.90

14.50

0.547

0.571

10.90

11.10

0.429

0.437

--2.90

--0.114

5.80

6.20

0.228

0.244

0.65

0.026

11.05

0.435

-0.10

-0.004

15.50

15.90

0.610

0.626

--1.10

--0.043

0.80

1.10

0.031

0.043

2.25

2.60

0.089

0.102

10 degrees

0.30

0.012

--8 degrees

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