DSPIC33FJ06GS101 datasheet(20/386 Pages) MICROCHIP

20 / 386 page

dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04

DS70318F-page 20

FIGURE 2-1:

RECOMMENDED

MINIMUM CONNECTION

2.2.1

TANK CAPACITORS

On boards with power traces running longer than six

inches in length, it is suggested to use a tank capacitor

for integrated circuits including DSCs to supply a local

power source. The value of the tank capacitor should

be determined based on the trace resistance that con-

nects the power supply source to the device, and the

maximum current drawn by the device in the applica-

tion. In other words, select the tank capacitor so that it

meets the acceptable voltage sag at the device. Typical

values range from 4.7 µF to 47 µF.

2.3

Capacitor on Internal Voltage

Regulator (VCAP)

A low-ESR (< 5 Ohms) capacitor is required on the

VCAP pin, which is used to stabilize the voltage

regulator output voltage. The VCAP pin must not be

connected to VDD, and must have a capacitor between

4.7 µF and 10 µF, 16V connected to ground. The type

can be ceramic or tantalum. Refer to Section 24.0

“Electrical

Characteristics”

for

additional

information.

The placement of this capacitor should be close to the

VCAP. It is recommended that the trace length not

exceed one-quarter inch (6 mm). Refer to Section 21.2

“On-Chip Voltage Regulator” for details.

2.4

Master Clear (MCLR) Pin

The

MCLR

provides

two

specific

device

functions:

• Device Reset

• Device programming and debugging.

During device programming and debugging, the

resistance and capacitance that can be added to the

pin must be considered. Device programmers and

debuggers

drive

the

MCLR

pin.

Consequently,

specific voltage levels (VIH and VIL) and fast signal

transitions must not be adversely affected. Therefore,

specific values of R and C will need to be adjusted

based on the application and PCB requirements.

For

example,

shown

Figure 2-2,

recommended that the capacitor C, be isolated from

the MCLR pin during programming and debugging

operations.

Place the components shown in Figure 2-2 within

one-quarter inch (6 mm) from the MCLR pin.

FIGURE 2-2:

EXAMPLE OF MCLR PIN

CONNECTIONS

dsPIC33F

VDD

VSS

VDD

0.1 µF

Ceramic

0.1 µF

Ceramic

0.1 µF

Ceramic

0.1 µF

Ceramic

VDD

MCLR

0.1 µF

Ceramic

L1(1)

10 µF

Tantalum

Note

As an option, instead of a hard-wired connection, an

inductor (L1) can be substituted between VDD and

AVDD to improve ADC noise rejection. The inductor

impedance should be less than 1

Ω and the inductor

capacity greater than 10 mA.

Where:

FCNV

--------------

π LC

()

-----------------------

πfC

()

----------------------

⎝⎠

⎛⎞ 2

(i.e., ADC conversion rate/2)

Note 1:

≤ 10 kΩ is recommended. A suggested

starting value is 10 k

Ω. Ensure that the

MCLR pin VIH and VIL specifications are met.

≤ 470Ω will limit any current flowing into

MCLR from the external capacitor C, in the

event of MCLR pin breakdown, due to

Electrostatic Discharge (ESD) or Electrical

Overstress (EOS). Ensure that the MCLR pin

VIH and VIL specifications are met.

VDD

MCLR

dsPIC33F

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