30F4013 datasheet(172/228 Pages) MICROCHIP

172 / 228 page

dsPIC30F3014/4013

DS70138G-page 172

 2010 Microchip Technology Inc.

23.1

DC Characteristics

TABLE 23-1:

OPERATING MIPS vs. VOLTAGE

VDD Range

Temp Range

Max MIPS

dsPIC30FXXX-30I

dsPIC30FXXX-20E

4.5-5.5V

-40°C to 85°C

—

4.5-5.5V

-40°C to 125°C

—

3.0-3.6V

-40°C to 85°C

—

3.0-3.6V

-40°C to 125°C

—

2.5-3.0V

-40°C to 85°C

—

TABLE 23-2:

THERMAL OPERATING CONDITIONS

Rating

Symbol

Min

Typ

Max

Unit

dsPIC30F3014-30I

dsPIC30F4013-30I

Operating Junction Temperature Range

-40

—

+125

°C

Operating Ambient Temperature Range

-40

—

+85

°C

dsPIC30F3014-20E

dsPIC30F4013-20E

Operating Junction Temperature Range

-40

—

+150

°C

Operating Ambient Temperature Range

-40

—

+125

°C

Power Dissipation:

Internal chip power dissipation:

PINT + PI/O

I/O Pin power dissipation:

Maximum Allowed Power Dissipation

PDMAX

(TJ – TA)/

JA

PINT

VDD

IDD

IOH



–





PI/O

VDD

VOH

–

 I







VOL

I OL







TABLE 23-3:

THERMAL PACKAGING CHARACTERISTICS

Characteristic

Symbol

Typ

Max

Unit

Notes

Package Thermal Resistance, 40-pin DIP (P)

JA

—47

°C/W

Package Thermal Resistance, 44-pin TQFP (10x10x1mm)

JA

—39.3

°C/W

Package Thermal Resistance, 44-pin QFN

JA

—27.8

°C/W

Note 1:

Junction to ambient thermal resistance, Theta-ja (

JA) numbers are achieved by package simulations.

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