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ADSP-21062LABZ-160 Datasheet(PDF) 20 Page - Analog Devices |
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ADSP-21062LABZ-160 Datasheet(HTML) 20 Page - Analog Devices |
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20 / 64 page ![]() Rev. F | Page 20 of 64 | March 2008 ADSP-21060/ADSP-21060L/ADSP-21062/ADSP-21062L/ADSP-21060C/ADSP-21060LC EXTERNAL POWER DISSIPATION (3.3 V) Total power dissipation has two components, one due to inter- nal circuitry and one due to the switching of external output drivers. Internal power dissipation is dependent on the instruc- tion execution sequence and the data operands involved. Internal power dissipation is calculated in the following way: PINT = IDDIN u V DD The external component of total power dissipation is caused by the switching of output pins. Its magnitude depends on: • the number of output pins that switch during each cycle (O) • the maximum frequency at which they can switch (f) • their load capacitance (C) • their voltage swing (VDD) and is calculated by: PEXT = O u C u V DD 2 u f The load capacitance should include the processor’s package capacitance (CIN). The switching frequency includes driving the load high and then back low. Address and data pins can drive high and low at a maximum rate of 1/(2tCK). The write strobe can switch every cycle at a frequency of 1/tCK. Select pins switch at 1/(2tCK), but selects can switch on each cycle. Example: Estimate PEXT with the following assumptions: • A system with one bank of external data memory RAM (32-bit) • Four 128K u 8 RAM chips are used, each with a load of 10 pF • External data memory writes occur every other cycle, a rate of 1/(4tCK), with 50% of the pins switching • The instruction cycle rate is 40 MHz (tCK = 25 ns) The PEXT equation is calculated for each class of pins that can drive: A typical power consumption can now be calculated for these conditions by adding a typical internal power dissipation: PTOTAL = PEXT + (IDDIN2 u 5.0 V) Note that the conditions causing a worst-case PEXT are different from those causing a worst-case PINT. Maximum PINT cannot occur while 100% of the output pins are switching from all ones to all zeros. Note also that it is not common for an application to have 100% or even 50% of the outputs switching simultaneously. ABSOLUTE MAXIMUM RATINGS Stresses greater than those listed Table 7 may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specifica- tion is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 6. External Power Calculations (3.3 V Devices) Pin Type No. of Pins % Switching u C u f u VDD2 = PEXT Address 15 50 u 44.7 pF u 10 MHz u 10.9 V = 0.037 W MS0 10 u 44.7 pF u 10 MHz u 10.9 V = 0.000 W WR 1– u 44.7 pF u 20 MHz u 10.9 V = 0.010 W Data 32 50 u 14.7 pF u 10 MHz u 10.9 V = 0.026 W ADDRCLK 1 – u 4.7 pF u 20 MHz u 10.9 V = 0.001 W PEXT = 0.074 W Table 7. Absolute Maximum Ratings Parameter ADSP-21060/ADSP-21060C ADSP-21062 ADSP-21060L/ADSP-21060LC ADSP-21062L 5 V 3.3 V Supply Voltage (VDD) –0.3 V to +7.0 V –0.3 V to +4.6 V Input Voltage –0.5 V to VDD + 0.5 V –0.5 V to VDD +0.5 V Output Voltage Swing –0.5 V to VDD + 0.5 V –0.5 V to VDD + 0.5 V Load Capacitance 200 pF 200 pF Storage Temperature Range –65 qC to +150qC–65qC to +150qC Lead Temperature (5 seconds) 280 qC280qC Junction Temperature Under Bias 130 qC130qC |
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