STM8T143 datasheet(50/65 Pages) STMICROELECTRONICS

50 / 65 page

Package characteristics

STM8T143

50/65

DocID18315 Rev 6

10.1.2

UFDFPN8 package mechanical data

Figure 24. UFDFPN8-lead ultra thin fine pitch dual flat package (MLP) package outline

Table 26. UFDFPN8-lead ultra thin fine pitch dual flat - package mechanical data

Symbol

millimeters

inches (1)

1. Values in inches are rounded to 4 decimal digits

Min

Typ

Max

Min

Typ

Max

A(2)

2. In order to prevent undesired effects such as spurious detections or modified sensitivity the UFDFPN8

package should not be directly exposed to light sources (visible or invisible).

0.450

0.550

0.600

0.0177

0.0217

0.0236

0.000

0.020

0.050

0.0000

0.0008

0.0020

0.200

0.250

0.300

0.0079

0.0098

0.0118

1.900

2.000

2.100

0.0748

0.0787

0.0827

1.500

1.600

1.700

0.0591

0.0630

0.0669

2.900

3.000

3.100

0.1142

0.1181

0.1220

0.100

0.200

0.300

0.0039

0.0079

0.0118

0.500

0.0197

0.400

0.450

0.500

0.0157

0.0177

0.0197

0.150

0.0059

0.300

0.0118

Tolerance

millimeters

inches

ddd (3)

3. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from

measuring.

0.080

0.0031

UFDFPN-01

ddd

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