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APW7323KAI-TRG Datasheet(PDF) 3 Page - Anpec Electronics Coropration |
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APW7323KAI-TRG Datasheet(HTML) 3 Page - Anpec Electronics Coropration |
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3 / 22 page ![]() Copyright © ANPEC Electronics Corp. Rev. A.5 - Aug., 2013 APW7323/A www.anpec.com.tw 3 Symbol Parameter Range Unit VCC VCC Supply Voltage 2.9~ 6 V VIN VIN Supply Voltage 2.6~6 V VOUT Converter Output Voltage 0.8~6 V L Inductance 1~4.7 µH COUT Output Capacitor 10~220 µF IOUT Converter Output Current 0~3.2 A TA Ambient Temperature -40 ~ 85 oC TJ Junction Temperature -40 ~ 125 oC Recommended Operating Conditions (Note 4) Electrical Characteristics Unless otherwise specified, these specifications apply over V CC=VIN=5V, VOUT=3.3V and TA=-40~85 oC. Typical values are at T A=25 oC. Note 4: Refer to the typical application circuit. APW7323/A Symbol Parameter Test Conditions Min. Typ. Max. Unit SUPPLY CURRENT IVCC VCC Supply Current VFB=0.7V - 460 - µA IVCC_SD VCC Shutdown Supply Current EN=GND - - 40 µA POWER-ON-RESET (POR) VCC POR Voltage Threshold VCC Rising - 2.7 - V VCC POR Voltage Hysteresis VCC Falling - 200 - mV VCC Debounce Time - 10 - µs VIN POR Voltage Threshold VIN Rising - 2.3 - V VIN POR Voltage Hysteresis VIN Falling - 50 - mV REFERENCE VOLTAGE - 0.8 - V VREF Reference Voltage All temperature -1 - +1 % Output Accuracy IOUT=10mA~3A, VCC=2.9~5V -1.5 - +1.5 % Thermal Characteristics Symbol Parameter Typical Value Unit θ JA Junction-to-Ambient Resistance in Free Air (Note 2) SOP-8P TDFN3x3-10 50 oC/W θ JC Junction-to-Case Resistance in Free Air (Note 3) SOP-8P TDFN3x3-10 12 6 oC/W Note 2: θ JA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad of SOP-8P and TDFN3x3-10 is soldered directly on the PCB. Note 3: The case temperature is measured at the center of the exposed pad on the underside of the package. |
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