THS8083APZP datasheet(53/64 Pages) TI

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6–1

6 Application Information

6.1

Designing With PowerPAD



The THS8083A is housed in a high-performance, thermally enhanced, 100-pin PowerPAD package (TI package

designator: 100PZP). Use of the PowerPAD package does not require any special considerations except to note that

the PowerPAD, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor.

Therefore, if not implementing the PowerPAD PCB features, the use of solder masks (or other assembly techniques)

may be required to prevent any inadvertent shorting by the exposed PowerPAD of connection etches or vias under

the package. The recommended option, however, is not to run any etches or signal vias under the device, but to have

only a grounded thermal land as explained below. Although the actual size of the exposed die pad may vary, the

minimum size required for the keepout area of the 100-pin PZP PowerPAD package is 5 mm

× 5 mm.

It is recommended that there be a thermal land, which is an area of solder-tinned-copper, underneath the PowerPAD

package. The thermal land varies in size, depending on the PowerPAD package being used, the PCB construction,

and the amount of heat that needs to be removed. In addition, the thermal land may or may not contain numerous

thermal vias, depending on PCB construction.

More information on this package and other requirements for using thermal lands and thermal vias are detailed in

the TI application note PowerPAD Thermally Enhanced Package Application Report, TI literature number SLMA002,

available via the TI Web pages beginning at URL: http://www.ti.com

For the THS8083A, this thermal land should be grounded to the low impedance ground plane of the device. This

improves thermal performance and the electrical grounding of the device. It is also recommended that the device

ground terminal landing pads be connected directly to the grounded thermal land. The land size should be as large

as possible without shorting device signal terminals. The thermal land may be soldered to the exposed PowerPAD

using standard reflow soldering techniques.

While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is

recommended that the thermal land be connected to the low impedance ground plane of the device.

Table 6-1 lists a comparison between the thermal resistances of the PowerPAD package (100PZP) used for this

device and a regular 100-pin TQFP package.

Table 6–1. Junction-Ambient and Junction-Case Thermal Resistances

100 PZP PowerPAD

 vs

AIRFLOW IN lfm

100 PZP PowerPAD

100 PIN REGULAR TQFP

150

250

500

θJA (°C/W) 100 PZP

17.3

11.8

10.4

9.0

θJC (°C/W) 100 PZP

0.12

θJA (°C/W) 100 pin regular

θJC (°C/W) 100 pin regular

PowerPAD is a trademark of Texas Instruments.

THS8083APZP Datasheet(PDF) 53 Page - Texas Instruments

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