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ZSSC3018BA2C Datasheet(PDF) 6 Page - Renesas Technology Corp |
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ZSSC3018BA2C Datasheet(HTML) 6 Page - Renesas Technology Corp |
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6 / 51 page ![]() ZSSC3018 Datasheet © 2020 Renesas Electronics Corporation 6 September 8, 2020 1. IC Characteristics 1.1 Absolute Maximum Ratings Note: The absolute maximum ratings are stress ratings only. The ZSSC3018 might not function or be operable above the recommended operating conditions. Stresses exceeding the absolute maximum ratings might also damage the device. In addition, extended exposure to stresses above the recommended operating conditions might affect device reliability. Renesas does not recommend designing to the “Absolute Maximum Ratings.” Table 1.1 Absolute Maximum Ratings PARAMETER SYMBOL Min TYP MAX UNITS Voltage Reference Vss 0 – 0 V Analog Supply Voltage VDD -0.4 – 3.63 V Voltage at all Analog and Digital IO Pins VA_IO, VD_IO -0.5 – VDD+0.5 V Input Current into any Pin except RES, TEST1, TEST2, TEST3, TEST4, TEST5, and SS [a], [b] IIN -100 – 100 mA Electrostatic Discharge Tolerance – Human Body Model (HBM1) [c] VHBM1 4000 – – V Storage Temperature TSTOR -50 – 130 °C [a] Latch-up current limit for RES, TEST1, TEST2, TEST3, TEST4, TEST5, and SS: ±70mA. [b] Latch-up resistance; reference for pin is 0V. [c] HBM1: C = 100pF charged to VHBM1 with resistor R = 1.5k in series based on MIL 883, Method 3015.7. ESD protection referring to the Human Body Model is tested with devices in ceramic dual in-line packages (CDIP) during product qualification. 1.2 Operating Conditions Note: The reference for all voltages is Vss. Table 1.2 Operating Conditions PARAMETER SYMBOL MIN TYP MAX UNIT Supply Voltage VDD 1.68 – 3.6 V VDD Rise Time tVDD – – 200 μs Bridge Current [a] IVDDB – – 1.8 mA – – 16.5 Operation Temperature Range TAMB -40 – 125 °C External (Parasitic) Capacitance between VDDB and VSS CL 0.01 – 50 nF [a] Power supply rejection is reduced if a current in the range of 16.5mA > IVDDB > 1.8mA is drawn out of VDDB. A dynamic power-on-reset circuit is implemented in order to achieve the minimum current consumption in Sleep Mode. The VDD low level, the subsequent rise time, and the VDD rising slope must meet the requirements in Table 1.3 to guarantee an overall IC reset: lower VDD low levels allow slower rising of the subsequent on-ramp of VDD. Other combinations might also be possible. For example, the reset trigger can be influenced by increasing the power-down time and lowering the VDD rising slope requirement. Alternatively, the RES pin can be connected and used to control safe resetting of the IC. RES is low-active – a VDD-VSS-VDD transition at the RES pin leads to a complete ZSSC3018 reset. |
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