AD7124-4TRUZ-EP-R7 datasheet(10/17 Pages) AD

10 / 17 page

AD7124-4-EP

Enhanced Product

Rev. 0 | Page 10 of 17

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 2.

Parameter

Rating

AVDD to AVSS

−0.3 V to +3.96 V

IOVDD to DGND

−0.3 V to +3.96 V

IOVDD to AVSS

−0.3 V to +5.94 V

AVSS to DGND

−1.98 V to +0.3 V

Analog Input Voltage to AVSS

−0.3 V to AVDD + 0.3 V

Reference Input Voltage to AVSS

−0.3 V to AVDD + 0.3 V

Digital Input Voltage to DGND

−0.3 V to IOVDD + 0.3 V

Digital Output Voltage to DGND

−0.3 V to IOVDD + 0.3 V

AINx/Digital Input Current

10 mA

Operating Temperature Range

−55°C to +125°C

Storage Temperature Range

−65°C to +150°C

Maximum Junction Temperature

150°C

Lead Temperature, Soldering

Reflow

260°C

ESD Ratings

Human Body Model (HBM)

4 kV

Field-Induced Charged Device

Model (FICDM)

1250 V

Machine Model

400 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection, junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure.

θJC is the junction to case thermal resistance.

Table 3. Thermal Resistance

Package Type1

θJA

θJC

Unit

RU-24

128

°C/W

1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal

test board. See JEDEC JESD51.

ESD CAUTION

AD7124-4TRUZ-EP-R7 Datasheet(PDF) 10 Page - Analog Devices

AD7124-4TRUZ-EP-R7 Datasheet(HTML) 10 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

Datasheet Download

Link URL