1. Intel® Stratix® 10 TX Device Overview

Intel® Stratix® 10 TX FPGAs feature power-efficient, dual-mode transceivers, capable

of both 57.8 Gbps PAM4 (Pulse Amplitude Modulation) and 28.9 Gbps NRZ (Non

Return to Zero) operation. Supported by hardened PCI Express Gen 3 and 10/25/100

Gbps Ethernet MAC IP blocks, these devices can deliver over 8 Tbps of aggregate

bandwidth, meeting the demanding transceiver bandwidth and power budget

specifications of next generation designs.

In addition to the 57.8 Gbps PAM4 / 28.9 Gbps NRZ dual-mode transceivers, Intel

Stratix 10 TX devices feature several other breakthrough innovations. These include

all new HyperFlex® core architecture, hardened floating point DSP blocks, hardened

external memory controllers and advanced packaging technology based on Intel's

Embedded Multi-die Interconnect Bridge (EMIB).

With an embedded quad-core 64-bit Arm* Cortex*-A53 hard processor system (HPS)

available in select devices, Intel Stratix 10 TX FPGAs deliver power efficient,

application-class processing, and allow designers to extend hardware virtualization

into the FPGA fabric.

Intel Stratix 10 TX FPGAs integrate a monolithic 14 nm FPGA fabric die with multiple

high-speed transceiver tiles, all inside a single flip-chip BGA package. This

implementation, combined with the unmatched transceiver bandwidth and core fabric

performance, demonstrates Intel's commitment to deliver high-performance

programmable solutions to your most challenging system design problems.

Important innovations in Intel Stratix 10 TX devices include:

•

All new Intel Hyperflex™ core architecture delivering 2X the core performance

compared to previous generation high-performance FPGAs

•

Intel 14 nm tri-gate (FinFET) technology

•

Heterogeneous 3D System-in-Package (SiP) technology

•

Monolithic core fabric with up to 2.8 million logic elements (LEs)

•

Up to 144 full duplex transceiver channels on heterogeneous 3D SiP transceiver

tiles

•

Transceiver data rates up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ for chip-to-chip,

chip-to-module, and backplane applications

•

Embedded eSRAM (47.25 Mbit) in select devices, and M20K (20 Kb) internal SRAM

memory blocks

•

Fractional synthesis and ultra-low jitter LC tank based transmit phase locked loops

(PLLs)

•

Hard PCI Express® Gen3 x16 intellectual property (IP) blocks

•

Hard 10/25/100 Gbps Ethernet MAC with dedicated Reed-Solomon FEC for NRZ

signals (528, 514) and PAM4 signals (544, 514)

683717 | 2022.08.18

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specifications in accordance with Intel's standard warranty, but reserves the right to make changes to any

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