MIMXRT8024DAF4A datasheet(7/103 Pages) NXP

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Table 1. Ordering information (continued)

Part Number

Features

Package

Junction

Temperature

Tj (°C)

• eDMA

• Boot ROM (128 KB)

• On-chip RAM (1 MB)

• SEMC

• GPT x2

• 4-channel PIT

• Qtimer x4

• PWM x4

• ENC x4

• WDOG x4

• LCD/CSI/PXP

• SPDIF x1

• SAI x3

• MQS x1

• USB OTG x2

• eMMC 4.5/SD 3.0 x2

• I2C x4

• FlexSPI x2

• CAN x2

• FlexCAN (with Flexible

Data-Rate supported)

• FlexIO x3

• 149 GPIOs (146

tightly coupled)

• HAB/DCP/BEE

• TRNG

• SNVS

• SJC

• ADC x2

• ACMP x4

• TSC

• DCDC

• Temperature sensor

• GPC hardware power

management controller

Figure 1 describes the part number nomenclature so that characteristics of a specific part number can be identified (for example,

cores, frequency, temperature grade, fuse options, and silicon revision). The primary characteristic which describes which data

sheet applies to a specific part is the temperature grade (junction) field.

Ensure to have the proper data sheet for specific part by verifying the temperature grade (junction) field and matching it to the

proper data sheet. If there are any questions, visit the web page nxp.com/IMXRT or contact an NXP representative for details.

NXP Semiconductors

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Data Sheet: Technical Data

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