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DFE252012P-2R2M Datasheet(PDF) 37 Page - Microchip Technology |
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DFE252012P-2R2M Datasheet(HTML) 37 Page - Microchip Technology |
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37 / 44 page ![]() 2020 Microchip Technology Inc. DS20006388A-page 37 MCP16501 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: 1. 2. 3. Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M Microchip Technology Drawing C04-21387 Rev A Sheet 2 of 2 24-Lead Very Thin Plastic Quad Flat, No Lead Package (RMB) - 4x4 mm Body [VQFN] Atmel Legacy Global Package Code ZZP Number of Terminals Overall Height Terminal Width Overall Width Terminal Length Exposed Pad Width Terminal Thickness Pitch Standoff Units Dimension Limits A1 A b E2 A3 e L E N 0.50 BSC 0.203 REF 0.30 0.18 - 0.00 0.25 0.40 - - 4.00 BSC MILLIMETERS MIN NOM 24 0.50 0.30 0.90 0.05 MAX K- 0.20 - Terminal-to-Exposed-Pad Overall Length Exposed Pad Length D D2 2.60 4.00 BSC 2.70 2.80 2.60 2.70 2.80 |
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