ISL8200AMM

FN8287 Rev 2.00

Page 5 of 24

June 3, 2015

23

NC

Not internal connected

PD1 Phase Thermal Pad Used for both the PHASE pin (Pin # 16) and for heat removal connecting to heat dissipation layers using vias. Connect this

pad to a copper island on the PCB board with the same shape as the pad; this is electrically connected to PHASE pin 16.

PD2 PVIN Thermal Pad Used for both the PVIN pin (Pin # 17) and for heat removal connecting to heat dissipation layers using vias. Connect this pad

to a copper island on the PCB board with the same shape as the pad; this is electrically connected to PVIN pin 17.

PD3 PGND Thermal Pad Used for both the PGND pin (Pin # 18) and for heat removal connecting to heat dissipation layers using vias. Connect this pad

to a copper island on the PCB board with the same shape as the pad; this is electrically connected to PGND pin 18.

PD4 VOUT Thermal Pad Used for both the VOUT pin (Pin # 19) and for heat removal connecting to heat dissipation layers using vias. Connect this pad

to a copper island on the PCB board with the same shape as the pad; this is electrically connected to VOUT pin 19.

Pin Descriptions (Continued)

PIN #

PIN NAME

PIN DESCRIPTION

Typical Application Circuits

FIGURE 3. SINGLE PHASE 10A 1.2V OUTPUT CIRCUIT

ISFETDRV

ISHARE_BUS

CLKOUT

FSYNC_IN

EN

FF

VIN

PVIN

VOUT

VOUT_SET

VSEN_REM-

PGOOD

PH_CNTRL

VCC

ISL8200AMMREP

VOUT

PGOOD

ISFETDRV1

RSET

VCC

PVIN

GROUND

VOUT

GROUND

2.2k

SET R1 AND R2 SUCH THAT

0.8V ≤ VEN ≤ 5.0V

RSET CAN CHANGE VOUT

DO NOT TIE EN DIRECTLY TO A POWER SOURCE

REFER TO TABLE 1