ADMFM2000ABVZ datasheet(6/28 Pages) AD

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Data Sheet

ADMFM2000

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 6 of 28

Table 2. Absolute Maximum Ratings

Parameter

Rating

Maximum Supply Voltage

VDD_LNA_1 and VDD_LNA_2

8 V

VDD_IF_1 and VDD_IF_2

7 V

VDD_LO_DRIVER_1, VDD_LO_DRIVER_2

10 V

VSS_DSAS

−7 V

Maximum Input Power

RF_IN_1 and RF_IN_2

23 dBm

MIXER_IN_1and MIXER_IN_2

21 dBm

RF_BYPASS_IN_1 and RF_BYPASS_IN_2

26 dBm

LO_IN

24 dBm

Switch Control Inputs

SW1_CTRL_A, SW1_CTRL_B, SW2_CTRL_A,

and SW2_CTRL_B

−7.5 V to +0.5 V

DSA Control Inputs

DSA1_V0, DSA1_V1, DSA1_V2, DSA1_V3,

DSA1_V4,DSA2_V0, DSA2_V1, DSA2_V2,

DSA2_V3, and DSA2_V4

7.5 V

Temperature

Operating Range

−40°C to +85°C

Storage Range

−40°C to +150°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

The Layout Recommendations section details and shows a design

that utilizes multiple ground vias to maximize heat dissipation from

the device package.

θJC is the junction-to-case thermal resistance.

Table 3. Thermal Resistance

Package Type1

θJC2

Unit

BV-179-1

°C/W

1 Based on simulations with JEDEC standard JESD-51.

2 The θJC thermal resistance was determined by simulation of the heat transfer

from the hottest localized circuit in the package through the ground paddle of

the PCB, with the PCB ground paddle held constant at 85°C. The associated

power consumption of this circuit is 0.35 W.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in and ESD-protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Charged device model (CDM) per ANSI/ESDA/JEDEC JS-002.

ESD Ratings for ADMFM2000

Table 4. ADMFM2000, 179-Ball BGA_CAV

ESD Model

Withstand Threshold (V)

Class

HBM

±250

CDM

RF Pins

±175

C0B

NonRF Pins

±500

C2A

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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