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ADMFM2000ABVZ Datasheet(PDF) 1 Page - Analog Devices |
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ADMFM2000ABVZ Datasheet(HTML) 1 Page - Analog Devices |
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1 / 28 page ![]() Data Sheet ADMFM2000 Dual-Channel, 0.5 GHz to 32 GHz, Microwave Downconverter Rev. 0 DOCUMENT FEEDBACK TECHNICAL SUPPORT Information furnished by Analog Devices is believed to be accurate and reliable "as is". However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. FEATURES ► Dual-channel, 0.5 GHz to 32 GHz receiver ► Integrated LNA ► Integrated downconversion mixer ► Integrated switch for mixer bypass ► Integrated IF LPF: 8 GHz bandwidth ► Integrated DSA ► DSA range: 31 dB with 1 dB step ► Single common LO input ► 50 Ω matched input and output ► 20.00 mm × 14.00 mm, 179-ball CSP_BGA APPLICATIONS ► Phased array radar receivers ► Satellite communications (satcom) receivers ► Electronic warfare ► Electronic test and measurement equipment ► Automatic test equipment GENERAL DESCRIPTION The ADMFM2000 is a dual-channel microwave downconverter, with input RF and local oscillator (LO) frequency ranges covering 5 GHz to 32 GHz, with an output intermediate frequency (IF) frequency range from 0.5 GHz to 8 GHz. The downconverting mixer can also be bypassed allowing direct access to the 0.5 to 8 GHz IF path. A common LO input signal is split to feed two separate buffer amplifiers to drive the mixer in each channel. Each down conversion path consists of a low noise amplifier (LNA), a mixer, an IF filter, a digital step attenuator (DSA), and an IF amplifier. Fabricated using a combination of surface mount and bare die components, the ADMFM2000 provides precise gain adjustment capabilities with low distortion performance. The ADMFM2000 comes in a compact, shielded 20.00 mm × 14.00 mm, 179-ball chip scale package ball grid array (CSP_BGA) and operates over a temperature range of −40°C to +85°C. FUNCTIONAL BLOCK DIAGRAM Figure 1. Functional Block Diagram |
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