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STM32G030F6 Datasheet(PDF) 56 Page - STMicroelectronics

Part # STM32G030F6
Description  Arm® Cortex®-M0 32-bit MCU, up to 64 KB Flash, 8 KB RAM, 2x USART, timers, ADC, comm. I/Fs, 2.0-3.6V
PDF  94 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32G030F6 Datasheet(HTML) 56 Page - STMicroelectronics

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Electrical characteristics
STM32G030x6/x8
56/94
DS12991 Rev 1
5.3.10
Flash memory characteristics
Jitter
RMS cycle-to-cycle jitter
System clock 56 MHz
-50
-
±ps
RMS period jitter
-
40
-
IDD(PLL)
PLL power consumption
on VDD(1)
VCO freq = 96 MHz
-
200
260
μA
VCO freq = 192 MHz
-
300
380
VCO freq = 344 MHz
-
520
650
1. Guaranteed by design.
2. Take care of using the appropriate division factor M to obtain the specified PLL input clock values. The M factor is shared
between the two PLLs.
Table 40. PLL characteristics(1) (continued)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Table 41. Flash memory characteristics(1)
1. Guaranteed by design.
Symbol
Parameter
Conditions
Typ
Max
Unit
tprog
64-bit programming time
-
85
125
µs
tprog_row
Row (32 double word) programming
time
Normal programming
2.7
4.6
ms
Fast programming
1.7
2.8
tprog_page Page (2 Kbyte) programming time
Normal programming
21.8
36.6
Fast programming
13.7
22.4
tERASE
Page (2 Kbyte) erase time
-
22.0
40.0
tprog_bank
Bank (64 Kbyte(2)) programming
time
2. Values provided also apply to devices with less Flash memory than one 64 Kbyte bank
Normal programming
0.7
1.2
s
Fast programming
0.4
0.7
tME
Mass erase time
-
22.1
40.1
ms
IDD(FlashA) Average consumption from VDD
Programming
3
-
mA
Page erase
3
-
Mass erase
5
-
IDD(FlashP) Maximum current (peak)
Programming, 2 µs
peak duration
7-
mA
Erase, 41 µs peak
duration
7-
Table 42. Flash memory endurance and data retention
Symbol
Parameter
Conditions
Min(1)
1. Guaranteed by characterization results.
Unit
NEND
Endurance
TA = -40 to +105 °C
1
kcycles
tRET
Data retention
1 kcycle(2) at TA = 85 °C
15
Years



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