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ADC32RF44IRMPR Datasheet(PDF) 127 Page - Texas Instruments |
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ADC32RF44IRMPR Datasheet(HTML) 127 Page - Texas Instruments |
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127 / 135 page  PACKAGE OPTION ADDENDUM www.ti.com 7-Oct-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) ADC32RF44IRMP Active Production VQFN (RMP) | 72 168 | JEDEC TRAY (5+1) Yes NIPDAU Level-3-260C-168 HR -40 to 85 AZ32RF44 ADC32RF44IRMP.A Active Production VQFN (RMP) | 72 168 | JEDEC TRAY (5+1) Yes NIPDAU Level-3-260C-168 HR -40 to 85 AZ32RF44 ADC32RF44IRMPG4 Active Production VQFN (RMP) | 72 168 | JEDEC TRAY (5+1) Yes NIPDAU Level-3-260C-168 HR -40 to 85 AZ32RF44 ADC32RF44IRMPG4.A Active Production VQFN (RMP) | 72 168 | JEDEC TRAY (5+1) Yes NIPDAU Level-3-260C-168 HR -40 to 85 AZ32RF44 ADC32RF44IRMPR Active Production VQFN (RMP) | 72 1500 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 85 AZ32RF44 ADC32RF44IRMPR.A Active Production VQFN (RMP) | 72 1500 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 85 AZ32RF44 ADC32RF44IRMPT Active Production VQFN (RMP) | 72 250 | SMALL T&R Yes NIPDAU Level-3-260C-168 HR -40 to 85 AZ32RF44 ADC32RF44IRMPT.A Active Production VQFN (RMP) | 72 250 | SMALL T&R Yes NIPDAU Level-3-260C-168 HR -40 to 85 AZ32RF44 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Addendum-Page 1 |
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