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ADC32RF44IRMPR Datasheet(PDF) 126 Page - Texas Instruments |
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ADC32RF44IRMPR Datasheet(HTML) 126 Page - Texas Instruments |
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126 / 135 page  126 ADC32RF44 SBAS809A – FEBRUARY 2017 – REVISED MARCH 2017 www.ti.com Product Folder Links: ADC32RF44 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated 13 Device and Documentation Support 13.1 Documentation Support 13.1.1 Related Documentation For related documentation see the following: • ADC32RF45/RF80 EVM Quick Startup Guide • Configuration Files for the ADC32RF45 13.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 13.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 13.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 13.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 13.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. |
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