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STM32WB09XE Datasheet(PDF) 5 Page - STMicroelectronics

Part # STM32WB09XE
Description  Ultra-low power wireless 32-bit MCU Arm®-based Cortex®-M0 with Bluetooth® LE and 2.4 GHz radio solution
PDF  73 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32WB09XE Datasheet(HTML) 5 Page - STMicroelectronics

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Description
The STM32WB09xE is an ultra-low power programmable Bluetooth® LE wireless SoC solution. It embeds
STMicroelectronics’ state-of-art 2.4 GHz RF radio peripherals, optimized for ultra-low-power consumption and
excellent radio performance, for unparalleled battery lifetime.
It is compliant with Bluetooth® LE SIG core specification version 5.4 addressing point-to-point connectivity and
Bluetooth® Mesh networking and allows large-scale device networks to be established in a reliable way. The
STM32WB09xE is also suitable for 2.4 GHz proprietary radio wireless communication to address ultra-low latency
applications.
The STM32WB09xE embeds an Arm® Cortex®-M0+ microprocessor that can operate up to 64 MHz and also the
radio core coprocessor (DMA based) for Bluetooth® LE timing critical operations.
In addition, the STM32WB09xE provides enhanced security hardware support by dedicated hardware functions:
true random number generator (TRNG) supporting NIST special publication 800-90B, security c0-processor for
128-bit AES encryption, CRC calculation unit, 64-bit unique ID, flash memory read and write protection, and a
public key accelerator (PKA).
The PKA supports: modular arithmetic including exponentiation with maximum modulo size of 3136 bits, elliptic
curves over prime field scalar multiplication, ECDSA signature, ECDSA verification with maximum modulo size of
521 bits CRC calculation unit, security level allowing constant time operations.
The STM32WB09xE can be configured to support standalone or network processor applications. In the first
configuration, the STM32WB09xE operates as a single device running the application code and the Bluetooth®
LE stack.
The STM32WB09xE embeds the following high-speed memory types: 512-Kbyte flash memory, 64-Kbyte RAM, 1-
Kbyte one-time-programmable (OTP) memory area, and 7-Kbyte ROM (ST reserved area).
Direct data transfer between memory and peripherals and from memory-to-memory is supported by eight DMA
channels with a full flexible channel mapping by the DMAMUX peripheral.
The STM32WB09xE embeds a 12-bit ADC, allowing measurements of up to eight external sources and up to
three internal sources, including battery monitoring and a temperature sensor.
The STM32WB09xE has a low-power RTC and one advanced 16-bit timer.
The STM32WB09xE features standard and advanced communication interfaces: 1x SPI-I2, LPUART, 1x USART
supporting ISO 7816 (SmartCard mode), IrDA and Modbus mode, 2x I2C supporting SMBus/PMBus.
The STM32WB09xE operates in the -40 to +105 °C (+125 °C junction) temperature range from a 1.7 V to 3.6 V
power supply. A comprehensive set of power-saving modes enables the design of low-power applications.
The STM32WB09xE integrates a high efficiency SMPS step-down converter and an integrated PDR circuitry with
a fixed threshold that generates a device reset when the VDD drops under 1.65 V.
The STM32WB09xE is available in two package types: VFQFPN32 and WLCSP36. Both versions support up to
20 I/Os.
Table 1. STM32WB09xE device features and peripheral counts
Feature
STM32WB09KE
STM32WB09TE
Flash memory density
512 Kbytes
SRAM density
SRAM0
16 Kbytes
SRAM1
16 Kbytes
SRAM2
16 Kbytes
SRAM3
16 Kbytes
Bluetooth LE
Yes
2.4 GHz proprietary radio
Yes
Timers
General purpose
1x 16-bit, four channels and
2x 16-bit, two channels
2.4 GHz proprietary radio timer low power
32-bit
SysTick
1
STM32WB09xE
Description
DS14210 - Rev 6
page 5/73



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