STM32WB09XE datasheet(60/73 Pages) STMICROELECTRONICS

Part #	STM32WB09XE

Description	Ultra-low power wireless 32-bit MCU Arm®-based Cortex®-M0 with Bluetooth® LE and 2.4 GHz radio solution

PDF	73 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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60 / 73 page

7.3

WLCSP36 package information (B0LY)

This WLCSP is a 36-ball, 2.83 x 2.99 mm, 0.40 mm pitch, wafer level chip scale package.

Figure 19. WLCSP36 - Outline

(0.335)

(0.269)

(0.630)

(0.289)

(0.421)

A2 BALL LOCATION

BOTTOM VIEW

DETAIL A

SIDE VIEW

ccc

ddd

eee

b (36x)

SEATING PLANE

DETAIL A

ROTATED 90°

BUMP

FRONT VIEW

aaa

TOP VIEW

(4x)

bbb Z

1. Drawing is not to scale.

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.

4. Bump position designation per JESD 95-1, SPP-010. The tolerance of position that controls the location of the

pattern of balls with respect to datums X and Y. For each ball there is a cylindrical tolerance zone ccc

perpendicular to datum Z and located on true position with respect to datums X and Y as defined by e. The

axis perpendicular to datum Z of each ball must lie within this tolerance zone.

STM32WB09xE

Package information

DS14210 - Rev 6

page 60/73

STM32WB09XE Datasheet(PDF) 60 Page - STMicroelectronics