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AS4DDR232M64PBGR-3/XT Datasheet(PDF) 5 Page - Austin Semiconductor

Part # AS4DDR232M64PBGR-3/XT
Description  32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit
PDF  28 Pages
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Manufacturer  AUSTIN [Austin Semiconductor]
Direct Link  http://www.austinsemiconductor.com
Logo AUSTIN - Austin Semiconductor

AS4DDR232M64PBGR-3/XT Datasheet(HTML) 5 Page - Austin Semiconductor

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iiiiiPEM
PEM
PEM
PEM
PEM
2.1 G
2.1 G
2.1 G
2.1 G
2.1 Gbbbbb SDRAM-DDR2
SDRAM-DDR2
SDRAM-DDR2
SDRAM-DDR2
SDRAM-DDR2
AS4DDR232M64PBG
AS4DDR232M64PBG
Rev. 1.3 6/09
Austin Semiconductor, Inc. ● Austin, Texas ● 512.339.1188 ● www.austinsemiconductor.com
5
Austin Semiconductor, Inc.
following two sets of conditions (A or B) must be met to
obtain a stable supply state (stable supply defi ned as
V
CC,
V
CCQ,
V
REF,
and V
TT
are between their
minimum and maximum values as stated in Table20);
A. (single power source) The V
CC voltage ramp from
300mV to V
CC (MIN) must take no longer than
200ms; during the V
CC voltage ramp, |VCC - VCCQ|
± 0.3V. Once supply voltage ramping is complete
(when V
CCQ
crosses V
CC
(MIN)), Table 20
specifications apply.
•V
CC, VCCQ are driven from a single power converter
output
•V
TT is limited to 0.95V MAX
•V
REF
tracks V
CCQ/2;
V
REF
must be within
± 0.3V with respect to V
CCQ/2 during supply ramp
time
•V
CCQ > VREF at all times
B. (multiple power sources) V
CC > VCCQ must be
maintained during supply voltage ramping, for both
AC and DC levels, until supply voltage ramping
completes (V
CCQ crosses VCC [MIN]).
Once supply
voltage ramping is complete, Table 20 specifications
apply.
• Apply V
CC
before or at the same time as
V
CCQ; VCC voltage ramp time must be < 200ms
from when V
CC ramps from 300mV to VCC (MIN)
• Apply V
CCQ before or at the same time as VTT; the
V
CCQ voltage ramp time from when VCC (MIN) is
achieved to when V
CCQ (MIN) is achieved must be
<500ms; while V
CC is ramping, current can be
supplied from V
CC through the device to VCCQ
• VREF must track VCCQ/2, VREF must be within
± 0.3V with respect to V
CCQ/2 during supply ramp
time; V
CCQ > V REF must be met at all times
• Apply V
TT; The VTT voltage ramp time from when
V
CCQ (MIN) is achieved to when VTT (MIN) is achieved
must be no greater than 500ms
2.
For a minimum of 200
µs after stable power nd clock
(CK, CK#), apply NOP or DESELECT commands and
take CKE HIGH.
3.
Wait a minimum of 400ns, then issue a PRECHARGE
ALL command.
4.
Issue an LOAD MODE command to the EMR(2). (To
issue an EMR(2) command, provide LOW to BA0,
provide HIGH to BA1.)
5.
Issue a LOAD MODE command to the EMR(3). (To
issue an EMR(3) command, provide HIGH to BA0 and
BA1.)
6.
Issue an LOAD MODE command to the EMR to enable
DLL. To issue a DLL ENABLE command, provide LOW
to BA1 and A0, provide HIGH to BA0. Bits E7, E8, and
E9 can be set to “0” or “1”; Micron recommends setting
them to “0”.
7.
Issue a LOAD MODE command for DLL RESET. 200
cycles of clock input is required to lock the DLL. (To
issue a DLL RESET, provide HIGH to A8 and provide
LOW to BA1, and BA0.) CKE must be HIGH the entire
time.
8.
Issue PRECHARGE ALL command.
9.
Issue two or more REFRESH commands, followed
by a dummy WRITE.



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