MPC7450EC datasheet(35/52 Pages) MOTOROLA

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MOTOROLA

MPC7450 RISC Microprocessor Hardware Speciﬁcations

Package Description

1.8.2

Mechanical Dimensions for the MPC7450, 483 CBGA

Figure 19 provides the mechanical dimensions and bottom surface nomenclature for the MPC7450, 483

CBGA package.

Figure 19. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7450, 483 CBGA

0.2

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.

3. TOP SIDE A1 CORNER INDEX IS A

METALIZED FEATURE WITH VARIOUS

SHAPES. BOTTOM SIDE. A1 CORNER

IS DESIGNATED WITH A BALL

MISSING FROM THE ARRAY.

A1 CORNER

0.2

1 23456789 10 111213141516

0.2 A

171819

Millimeters

DIM

MIN

MAX

3.22

0.80

1.00

1.08

1.32

0.60

0.82

0.93

29.00 BSC

—

11.6

8.94

—

6.9

1.27 BSC

29.00 BSC

—

11.6

8.94

—

6.9

483X

0.3

0.15

2021 22

Capacitor Region

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

IVE

D B

Y F

INC

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