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MPC7450EC Datasheet(PDF) 44 Page - Motorola, Inc

Part # MPC7450EC
Description  Freescale Semiconductor, Inc.
PDF  52 Pages
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Manufacturer  MOTOROLA [Motorola, Inc]
Direct Link  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

MPC7450EC Datasheet(HTML) 44 Page - Motorola, Inc

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MPC7450 RISC Microprocessor Hardware Specifications
MOTOROLA
System Design Information
sinks may be attached to the package by several methods—spring clip to holes in the printed-circuit board
or package, and mounting clip and screw assembly (see Figure 24); however, due to the potential large mass
of the heat sink, attachment through the printed circuit board is suggested. If a spring clip is used, the spring
force should not exceed 5.5 pounds.
Figure 24. Package Exploded Cross-Sectional View with Several Heat Sink Options
The board designer can choose between several types of heat sinks to place on the MPC7450. There are
several commercially available heat sinks for the MPC7450 provided by the following vendors:
Chip Coolers Inc.
800-227-0254 (USA/Canada)
333 Strawberry Field Rd.
401-739-7600
Warwick, RI 02887-6979
Internet: www.chipcoolers.com
International Electronic Research Corporation (IERC)
818-842-7277
135 W. Magnolia Blvd.
Burbank, CA 91502
Internet: www.ctscorp.com
Thermalloy
972-243-4321
2021 W. Valley View Lane
Dallas, TX 75234-8993
Internet: www.thermalloy.com
Wakefield Engineering
781-406-3000
100 Cummings Center, Suite 157H
Beverly, MA 01915
Internet: www.wakefield.com
Aavid Engineering
972-551-7330
250 Apache Trail
Terrell, TX 75160
Internet: www.aavid.com
Thermal Interface Material
Heat Sink
CBGA Package
Heat Sink
Clip
Printed-Circuit Board
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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