NAND01G-B2C datasheet(62/67 Pages) NUMONYX

62 / 67 page

Package mechanical

NAND01G-B2C

62/67

Package mechanical

To meet environmental requirements, Numonyx offers these devices in RoHS compliant

packages, which have a lead-free second-level interconnect. The category of second-level

interconnect is marked on the package and on the inner box label, in compliance with

JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also

marked on the inner box label.

RoHS compliant specifications are available at www.numonyx.com.

Figure 38.

TSOP48 - 48 lead plastic thin small outline, 12 x 20 mm, package outline

Drawing is not to scale.

TSOP-G

DIE

Table 26.

TSOP48 - 48 lead plastic thin small outline, 12 x 20 mm, package mechanical data

Symbol

millimeters

inches

Typ

Min

Max

Typ

Min

Max

1.20

0.047

0.10

0.05

0.15

0.004

0.002

0.006

1.00

0.95

1.05

0.039

0.037

0.041

0.22

0.17

0.27

0.009

0.007

0.011

0.10

0.21

0.004

0.008

0.08

0.003

12.00

11.90

12.10

0.472

0.468

0.476

20.00

19.80

20.20

0.787

0.779

0.795

18.40

18.30

18.50

0.724

0.720

0.728

e0.50–

–

0.020

–

0.60

0.50

0.70

0.024

0.020

0.028

0.80

0.031

3°

0°

5°

3°

0°

5°

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