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SL2S3003FUD Datasheet(PDF) 5 Page - NXP Semiconductors |
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SL2S3003FUD Datasheet(HTML) 5 Page - NXP Semiconductors |
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5 / 82 page ![]() NXP Semiconductors SL2S3003/SL2S3003TT ICODE 3 (TagTamper) 4 Ordering information Package Part number Description Version SL2S3003FUD Wafer sawn, 12" bumped wafer, 120 μm, on film frame carrier, Ci between LA and LB = 23.5 pF (typical) - SL2S3003TTFUD Wafer sawn, 12" bumped wafer, 120 μm, on film frame carrier, Ci between LA and LB = 23.5 pF (typical), with TagTamper - Table 1. Ordering information SL2S3003/SL2S3003TT All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 3.0 — 28 March 2024 5 / 82 |
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