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M24M02E-F Datasheet(PDF) 41 Page - STMicroelectronics |
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M24M02E-F Datasheet(HTML) 41 Page - STMicroelectronics |
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41 / 54 page ![]() Note: The package top may be smaller than the package bottom. Dimensions D and E1 are determinated at the outermost extremes of the plastic body exclusive of the mold flash, tie bar burrs, gate burrs, and interleads flash, but including any mismatch between the top and bottom of the plastic body. The measurement side for the mold flash, protrusions, or gate burrs is the bottom side. Figure 31. TSSOP8 – Footprint example 1.55 5.80 7.35 1. Dimensions are expressed in millimeters. M24M02E-F Package information DS14157 - Rev 2 page 41/54 |
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