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M24M02E-F Datasheet(PDF) 42 Page - STMicroelectronics |
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M24M02E-F Datasheet(HTML) 42 Page - STMicroelectronics |
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42 / 54 page  10.3 UFDFPN8 (DFN8) package information This UFDFPN is an 8-lead, 2 x 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat package. Figure 32. UFDFPN8 - Outline Top view Pin #1 ID marking Side view Seating plane eee ccc C C C C C B A 1 2 N D E aaa aaa A A1 2x 2x Datum A Terminal tip Detail “A” Even terminal L1 L3 L e e/2 Pin #1 ID marking Bottom view See Detail “A” e e 1 2 ND-1 x D2 L1 L3 E2 K L b 1. The maximum package warpage is 0.05 mm. 2. Exposed copper is not systematic and can appear partially or totally according to the cross section. 3. Drawing is not to scale. 4. The central pad (the area E2 by D2 in the above illustration) must be either connected to VSS or left floating (not connected) in the end application. M24M02E-F Package information DS14157 - Rev 2 page 42/54 |
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