M65KG512AB8W9 datasheet(32/54 Pages) STMICROELECTRONICS

32 / 54 page

DC and ac parameters

M65KG526AB

32/54

tDSS

(4)

UDQS/LDQS Falling Edge to K Setup Time

0.2

tCK

tDSH

(4)

UDQS/LDQS Falling Edge Hold Time from K

0.2

tCK

tDQSH

UDQS/LDQS High Pulse Width

0.35

tCK

tDQSL

UDQS/LDQS Low Pulse Width

0.35

tCK

tDPE

tPDEN Power-Down Entry Time

tCK

tDPX

tPDEX Power-Down Exit Time

tCK

tMRD

Mode Register Set Cycle Time

tCK

tPROZ

(1)

tHZP Precharge Command to Data Output High-Z

tCK

tRPD

Delay Time from Read to Precharge Command

(same Bank)

BL/2(2)

tCK

tRWD

Delay Time from Read to Write Command (all

data output)

3+BL/2

(2)

3+BL/2

(2)

tCK

tRPRE

Read Preamble Time

0.9

1.1

0.9

1.1

tCK

tRPST

Read Postamble Time

0.4

0.6

0.4

0.6

tCK

tSRE

tSREX Self Refresh Exit Time

TJ = −30 to 85 °C

tCK

TJ =−30 to 105 °C

tCK

tWPD

Delay Time from Write to Precharge Command

(same Bank)

3+BL/2

(2)

3+BL/2

(3)

tCK

tWRD

Delay Time from Write to Read Command

(all data input)

2+BL/2

(2)

2+BL/2

(2)

tCK

tWCD

Write Command to Data Input Latency

tCK

tWR

Write Recovery Time

TJ = −30 to 85 °C

tCK

TJ =−30 to 105 °C

tCK

tWTR

Internal Write to Read

command Delay

TJ = −30 to 85 °C

tCK

TJ =−30 to 105 °C

tCK

tWPRE

Write Preamble

0.25

tCK

tWPST

(4)

Data Strobe Low Pulse Width (Write Postamble)

0.4

0.6

0.4

0.6

tCK

CAS Latency equals 3 clock cycles.

BL stands for Burst Length.

The transition for Low-Z to High-Z occur when the device outputs become floating. No specific reference voltage is given in

this document.

Table 17.

AC characteristics measured in clock period (continued)

Symbol

Alt

Parameter

M65KG512AB

Unit

133MHz

166MHz

Min

Max

Min

Max

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