TAS5802PWPR datasheet(87/106 Pages) TI2

87 / 106 page

8.3.1 DVDD Supply

The DVDD supply that is required from the system is used to power several portions of the device. As shown

in Figure 8-3, it provides power to the DVDD pin. Proper connection, routing and decoupling techniques are

highlighted in Section 8 and Section 8.4.2 and must be followed as closely as possible for proper operation and

performance.

Some portions of the device also require a separate power supply that is a lower voltage than the DVDD

supply. To simplify the power supply requirements for the system, the TAS5802 device includes an integrated

low dropout (LDO) linear regulator to create this supply. This linear regulator is internally connected to the DVDD

supply and its output is presented on the DVDD_REG pin, providing a connection point for an external bypass

capacitor. It is important to note that the linear regulator integrated in the device has only been designed to

support the current requirements of the internal circuitry, and should not be used to power any additional external

circuitry. Additional loading on this pin could cause the voltage to sag, negatively affecting the performance and

operation of the device.

8.3.2 PVDD Supply

The output stage of the speaker amplifier drives the load using the PVDD supply. This is the power supply which

provides the drive current to the load during playback. Proper connection, routing, and decoupling techniques

are highlighted in the TAS5802EVM and must be followed as closely as possible for proper operation and

performance. Due to the high-voltage switching of the output stage, it is particularly important to properly

decouple the output power stages in the manner described in the TAS5802 device Section 8. Lack of proper

decoupling, like that shown in the Section 8, results in voltage spikes which can damage the device.

A separate power supply is required to drive the gates of the MOSFETs used in the output stage of the speaker

amplifier. This power supply is derived from the PVDD supply via an integrated linear regulator. A GVDD pin is

provided for the attachment of decoupling capacitor for the gate drive voltage regulator. It is important to note

that the linear regulator integrated in the device has only been designed to support the current requirements of

the internal circuitry, and should not be used to power any additional external circuitry. Additional loading on this

pin could cause the voltage to sag, negatively affecting the performance and operation of the device.

Another separate power supply is derived from the PVDD supply via an integrated linear regulator is AVDD.

AVDD pin is provided for the attachment of decoupling capacitor for the TAS5802 internal circuitry. It is

important to note that the linear regulator integrated in the device has only been designed to support the current

requirements of the internal circuitry, and should not be used to power any additional external circuitry. Additional

loading on this pin could cause the voltage to sag, negatively affecting the performance and operation of the

device.

8.4 Layout

8.4.1 Layout Guidelines

8.4.1.1 General Guidelines for Audio Amplifiers

Audio amplifiers which incorporate switching output stages must have special attention paid to their layout and

the layout of the supporting components used around them. The system level performance metrics, including

thermal performance, electromagnetic compliance (EMC), device reliability, and audio performance are all

affected by the device and supporting component layout.

Ideally, the guidance provided in the applications section with regard to device and component selection can

be followed by precise adherence to the layout guidance shown in Section 8.4.2. These examples represent

exemplary baseline balance of the engineering trade-offs involved with lying out the device. These designs can

be modified slightly as needed to meet the needs of a given application. In some applications, for instance,

solution size can be compromised to improve thermal performance through the use of additional contiguous

copper neat the device. Conversely, EMI performance can be prioritized over thermal performance by routing

on internal traces and incorporating a via picket-fence and additional filtering components. In all cases, it is

recommended to start from the guidance shown in Section 8.4.2 and work with TI field application engineers or

through the E2E community to modify it based upon the application specific goals.

www.ti.com

TAS5802

SLASFB7A – NOVEMBER 2024 – REVISED AUGUST 2025

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TAS5802PWPR Datasheet(PDF) 87 Page - Texas Instruments

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